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Micro focus X-ray non-destructive inspection device TXV-CH4090FD
The special TXV-CH4090FD can not only achieve X-ray oblique fluoroscopy but also perform 3D inspection, suitable for checking BGA virtual soldering an
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TXV-CH4090FDNot only can it be achievedXOblique radiography can also be implemented3 Inspection, suitable forBGAInspection of virtual soldering and soldering status of components. Adopting the latest user interface, anyone can operate it simply and efficiently
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